absolute maximum ratings parameter irhm9064/irhm93064 units i d @ v gs = -12v, t c = 25c continuous drain current -35 i d @ v gs = -12v, t c = 100c continuous drain current -30 i dm pulsed drain current -192 p d @ t c = 25c max. power dissipation 250 w linear derating factor 2.0 w/c v gs gate-to-source voltage 20 v e as single pulse avalanche energy 500 mj i ar avalanche current -35 a e ar repetitive avalanche energy 25 mj dv/dt peak diode recovery dv/dt -5.5 v/ns t j operating junction -55 to 150 t stg storage temperature range package mounting surface temperature 300 ( for 5 sec.) weight 9.3 (typical) g pre-irradiation o c a 7/6/98 www.irf.com 1 p-channel rad hard pd - 91438a repetitive avalanche and dv/dt rated hexfet ? transistor irhm9064 irhm 93064 JANSR2N7424 -60 volt, 0.05 ? ? ? ? ? , rad hard hexfet international rectifier?s p-channel rad hard technology hexfets demonstrate excellent threshold voltage stability and breakdown voltage stability at total radiation doses as high as 3 x 10 5 rads (si). under identical pre- and post- radiation test conditions, international rectifier?s p-channel rad hard hexfets retain identical electrical specifications up to 1 x 10 5 rads (si) total dose. no compensation in gate drive circuitry is required. these devices are also capable of surviv- ing transient ionization pulses as high as 1 x 10 12 rads (si)/ sec, and return to normal operation within a few microsec- onds. single event effect (see) testing of international recti- fier p-channel rad hard hexfets has demonstrated immunity to see failure. since the p-channel rad hard process utilizes international rectifier?s patented hexfet tech- nology, the user can expect the highest quality and reliability in the industry. p-channel rad hard hexfet transistors also feature all of the well-established advantages of mosfets, such as voltage control, very fast switching, ease of paralleling and temperature stability of the electrical parameters. they are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high- energy pulse circuits in space and weapons environments. product summary part number bv dss r ds(on) i d irhm9064 -60v 0.0 5 ? -35a irhm93064 -60v 0.0 5 ? -35a features: radiation hardened up to 1 x 10 5 rads (si) single event burnout (seb) hardened single event gate rupture (segr) hardened gamma dot (flash x-ray) hardened neutron tolerant identical pre- and post-electrical test conditions repetitive avalanche rating dynamic dv/dt rating simple drive requirements ease of paralleling hermetically sealed electrically isolated ceramic eyelets
irhm9064, irhm93064, JANSR2N7424 pre-irradiation 2 www.irf.com electrical characteristics @ tj = 25c (unless otherwise specified) parameter min typ max units test conditions bv dss drain-to-source breakdown voltage -60 ? ? v v gs = 0v, i d = -1.0ma ? bv dss / ? t j temperature coefficient of breakdown ? -0.056 ? v/c reference to 25c, i d = -1.0ma voltage r ds(on) static drain-to-source ? ? 0.050 v gs = -12v, i d =-30a on-state resistance ? ? 0.053 ? v gs = -12v, i d = -35a v gs(th) gate threshold voltage -2.0 ? -4.0 v v ds = v gs , i d = -1.0ma g fs forward transconductance 18 ? ? s ( )v ds > -15v, i ds = -30a i dss zero gate voltage drain current ? ? -25 v ds = 0.8 x max rating,v gs =0v ? ? -250 v ds = 0.8 x max rating v gs = 0v, t j = 125c i gss gate-to-source leakage forward ? ? -100 v gs = -20v i gss gate-to-source leakage reverse ? ? 100 v gs = 20v q g total gate charge ? ? 300 v gs =-12v, i d = -35a q gs gate-to-source charge ? ? 70 nc v ds = max rating x 0.5 q gd gate-to-drain (?miller?) charge ? ? 91 t d (on) turn-on delay time ? ? 35 v dd = -30v, i d = -35a, t r rise time ? ? 150 r g = 2.35 ? t d (off) turn-off delay time ? ? 200 t f fall time ? ? 200 l d internal drain inductance ? 8.7 ? l s internal source inductance ? 8.7 ? c iss input capacitance ? 6700 ? v gs = 0v, v ds = -25v c oss output capacitance ? 2800 ? pf f = 1.0mhz c rss reverse transfer capacitance ? 920 ? na ? nh ns measured from drain lead, 6mm (0.25 in) from package to center of die. measured from source lead, 6mm (0.25 in) from package to source bond- ing pad. modified mosfet symbol showing the internal induc- tances. a source-drain diode ratings and characteristics parameter min typ max units test conditions i s continuous source current (body diode) ? ? -35 i sm pulse source current (body diode) ? ? -192 v sd diode forward voltage ? ? -3.0 v t j = 25c, i s = -35a, v gs = 0v t rr reverse recovery time ? ? 270 ns t j = 25c, i f = -35a, di/dt -100a/ s q rr reverse recovery charge ? ? 2.5 cv dd -50v t on forward turn-on time intrinsic turn-on time is negligible. turn-on speed is substantially controlled by l s + l d . a modified mosfet symbol showing the integral reverse p-n junction rectifier. * current is limited by pin diameter ( die current is 48a , see fig. 4 & 9 ) thermal resistance parameter min typ max units test conditions r thjc junction-to-case ? ? 0.50 r thcs case-to-sink ? 0.21 ? w/c r thja junction-to-ambient ? ? 48 typical socket mount
www.irf.com 3 irhm9064, irhm93064, JANSR2N7424 pre-irradiation radiation characteristics table 2. high dose rate 10 11 rads (si)/sec 10 12 rads (si)/sec parameter min typ max min typ max units test conditions v dss drain-to-source voltage ? ? -48 ? ? -48 v applied drain-to-source voltage during gamma-dot i pp ? -100 ? ? -100 ? a peak radiation induced photo-current di/dt ? -800 ? ? -160 ? a/sec rate of rise of photo-current l 1 0.1 ? ? 0.8 ? ? h circuit inductance required to limit di/dt radiation performance of rad hard hexfets table 1. low dose rate irhm9064 irhm93064 parameter 100k rads (si) 300k rads (si) units test conditions
min max min max bv dss drain-to-source breakdown voltage -60 ? -60 ? v v gs = 0v, i d = -1.0ma v gs(th) gate threshold voltage -2.0 -4.0 -2.0 -5.0 v gs = v ds , i d = -1.0ma i gss gate-to-source leakage forward ? -100 ? -100 na v gs = -20v i gss gate-to-source leakage reverse ? 100 ? 100 v gs = 20 v i dss zero gate voltage drain current ? -25 ? -25 a v ds =0.8 x max rating, v gs =0v r ds(on)1 static drain-to-source ? 0.05 ? 0.05 ? v gs = -12v, i d =-30a on-state resistance one v sd diode forward voltage ? -3.0 ? -3.0 v t c = 25c, i s = -35a,v gs = 0v international rectifier radiation hardened hexfets are tested to verify their hardness capability. the hard- ness assurance program at international rectifier comprises 3 radiation environments. every manufacturing lot is tested in a low dose rate (total dose) environment per mll-std-750, test method 1019 condition a. international rectifier has imposed a standard gate condition of -12 volts per note 6 and a v ds bias condition equal to 80% of the device rated voltage per note 7. pre- and post-irra- diation limits of the devices irradiated to 1 x 10 5 rads (si) are identical and are presented in table 1, col- umn 1, irhm9064. post-irradiation limits of devices irradiated to 3 x 10 5 rads(si) are presented in table 1, column 2, irhm93064. the values in table 1 will be met for either of the two low dose rate test cir- cuits that are used. both pre- and post-irradiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison. it should be noted that after an irradiation level of 1 x 10 5 rads (si) no changes in limits are specified in dc parameters. after an irra- diation of 3 x 10 5 only the v gs(th) max is affected. high dose rate testing may be done on a special request basis using a dose rate up to 1 x 10 12 rads (si)/sec (see table 2). international rectifier radiation hardened hexfets have been characterized in heavy ion single event effects (see) environments. single event effects char- acterization is shown in table 3. table 3. single event effects let (si) fluence range v ds bias v gs bias ion (mev/mg/cm 2 ) (ions/cm 2 ) (m) (v) (v) cu 28 3x 10 5 ~43 -60 5
irhm9064, irhm93064, JANSR2N7424 pre-irradiation 4 www.irf.com fig 4. normalized on-resistance vs. temperature fig 2. typical output characteristics fig 1. typical output characteristics fig 3. typical transfer characteristics 10 100 1000 0.1 1 10 100 20s pulse width t = 25 c j top bottom vgs -15v -12v -10v -9.0v -8.0v -7.0v -6.0v -5.0v -v , drain-to-source voltage (v) -i , drain-to-source current (a) ds d -5.0v 10 100 1000 0.1 1 10 100 20s pulse width t = 150 c j top bottom vgs -15v -12v -10v -9.0v -8.0v -7.0v -6.0v -5.0v -v , drain-to-source voltage (v) -i , drain-to-source current (a) ds d -5.0v 10 100 1000 5 6 7 8 9 10 11 12 v = -25v 20s pulse width ds -v , gate-to-source voltage (v) -i , drain-to-source current (a) gs d t = 25 c j t = 150 c j -60 -40 -20 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 t , junction temperature ( c) r , drain-to-source on resistance (normalized) j ds(on) v = i = gs d -12v -48a
www.irf.com 5 irhm9064, irhm93064, JANSR2N7424 pre-irradiation fig 8. maximum safe operating area fig 6. typical gate charge vs. gate-to-source voltage fig 5. typical capacitance vs. drain-to-source voltage fig 7. typical source-drain diode forward voltage 1 10 100 0 2000 4000 6000 8000 10000 12000 -v , drain-to-source voltage (v) c, capacitance (pf) ds v c c c = = = = 0v, c c c f = 1mhz + c + c c shorted gs iss gs gd , ds rss gd oss ds gd c iss c oss c rss 1 10 100 1000 1 10 100 1000 operation in this area limited by r ds(on) single pulse t t = 150 c = 25 c j c -v , drain-to-source voltage (v) -i , drain current (a) i , drain current (a) ds d 100us 1ms 10ms 0 100 200 300 400 0 5 10 15 20 q , total gate charge (nc) -v , gate-to-source voltage (v) g gs for test circuit see figure i = d 13 -35a v = -30v ds v = -48v ds 0.1 1 10 100 1000 0.0 1.0 2.0 3.0 4.0 5.0 v ,source-to-drain voltage (v) i , reverse drain current (a) sd sd v = 0 v gs t = 25 c j t = 150 c j
irhm9064, irhm93064, JANSR2N7424 pre-irradiation 6 www.irf.com fig 11. maximum effective transient thermal impedance, junction-to-case fig 9. maximum drain current vs. case temperature fig 10a. switching time test circuit fig 10b. switching time waveforms v ds -12v pulse width 1 s duty factor 0.1 % r d v gs v dd r g d.u.t. + - v ds 90% 10% v gs t d(on) t r t d(off) t f 25 50 75 100 125 150 0 10 20 30 40 50 t , case temperature ( c) -i , drain current (a) c d limited by package 0.001 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thjc c p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thjc 0.01 0.02 0.05 0.10 0.20 0.50 single pulse (thermal response)
www.irf.com 7 irhm9064, irhm93064, JANSR2N7424 pre-irradiation 25 50 75 100 125 150 0 200 400 600 800 1000 1200 1400 starting t , junction temperature ( c) e , single pulse avalanche energy (mj) j as i d top bottom -21a -30a -48a fig 12c. maximum avalanche energy vs. drain current fig 12b. unclamped inductive waveforms fig 12a. unclamped inductive test circuit t p v (br)dss i as fig 13b. gate charge test circuit fig 13a. basic gate charge waveform q g q gs q gd v g charge -12v d.u.t. v ds i d i g -3ma v gs .3 f 50k ? .2 f 12v current regulator same type as d.u.t. current sampling resistors + - -12v r g i as 0.01 ? t p d.u.t l v ds v dd driver a 15v -20v -12v - v dd +
irhm9064, irhm93064, JANSR2N7424 pre-irradiation 8 www.irf.com world headquarters: 233 kansas st., el segundo, california 90245, tel: (310) 322 3331 european headquarters: hurst green, oxted, surrey rh8 9bb, uk tel: ++ 44 1883 732020 ir canada: 7321 victoria park ave., suite 201, markham, ontario l3r 2z8, tel: (905) 475 1897 ir germany: saalburgstrasse 157, 61350 bad homburg tel: ++ 49 6172 96590 ir italy: via liguria 49, 10071 borgaro, torino tel: ++ 39 11 451 0111 ir far east: k&h bldg., 2f, 30-4 nishi-ikebukuro 3-chome, toshima-ku, tokyo japan 171 tel: 81 3 3983 0086 ir southeast asia: 315 outram road, #10-02 tan boon liat building, singapore 0316 tel: 65 221 8371 http://www.irf.com/ data and specifications subject to change without notice. 7/98 total dose irradiation with v ds bias. v ds = 0.8 rated bv dss (pre-irradiation) applied and v gs = 0 during irradiation per mll-std -750, method 1019, condition a. this test is performed using a flash x-ray source operated in the e-beam mode (energy ~2.5 mev), 30 nsec pulse.
all pre-irradiation and post-irradiation test conditions are identical to facilitate direct comparison for circuit applications. repetitive rating; pulse width limited by maximum junction temperature. refer to current hexfet reliability report. @ v dd = -25v, starting t j = 25 c, e as = [0.5 * l * (i l 2 )] peak i l = -35a, v gs = -12v, 25 r g 200 ? i sd -35a, di/dt 150a/ s, v dd bv dss , t j 150 c suggested rg = 2.35 ? pulse width 300 s; duty cycle 2% total dose irradiation with v gs bias. -12 volt v gs applied and v ds = 0 during irradiation per mil-std-750, method 1019, condition a. case outline and dimensions ? to-254aa 3.78 ( .149 ) 3.53 ( .139 ) -a- 13.84 ( .545 ) 13.59 ( .535 ) 6.60 ( .260 ) 6.32 ( .249 ) 20.32 ( .800 ) 20.07 ( .790 ) 13.84 ( .545 ) 13.59 ( .535 ) -c- 1.14 ( .045 ) 0.89 ( .035 ) 3.81 ( .150 ) 1.27 ( .050 ) 1.02 ( .040 ) -b - .12 ( .005 ) 3x 2x 3.81 ( .150 ) 1 2 3 17.40 ( .685 ) 16.89 ( .665 ) 31.40 ( 1.235 ) 30.39 ( 1.199 ) notes: 1. dimensioning & tolerancing per ansi y14.5m, 1982. 2. a ll d im e n s io n s a r e s h o w n in m illim e t e r s ( in c h e s ). .50 ( .020 ) m c a m b .25 ( .010 ) m c legend 1 - c o lle c tor 2 - e m itte r 3 - g a te w conforms to jedec outline to-254aa dimensions in millimeters and ( inches ) legend 1- drain 2- source 3- gate legend 1- drain 2- source 3- gate 1 2 3 caution beryllia warning per mil-prf-19500 package containing beryllia shall not be ground, sandblasted, machined, or have other operations performed on them which will produce beryllia or beryllium dust. furthermore, beryllium oxide packages shall not be placed in acids that will produce fumes containing beryllium.
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